Plastic has had limited applications within electronics because of its inability to conduct heat. The University of Michigan is changing that by utilizing ground breaking techniques to create heat conducting plastic polymers.
Imagine cars and aircraft that are as light as plastic, or computers with no metal components. We’re getting closer as the University of Michigan explores new ways to create heat conducting plastic.
Thus far, the electronics industry has not been able to capitalize on the light-weight, inexpensive properties of plastic because heat from the electronics has no way to escape. New techniques are being explored that allow hydrogen pathways through the plastic to create a clear escape route for the heat generated by the electronic components.
— Watch this video to see this technology in action —
These new polymers will allow many more electronic devices to be encapsulated in plastic without over-heating. Learn more about electronic encapsulation by reading our blog post- Potting: Electronic Encapsulation.
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